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HP HP2-T19 Exam Syllabus Topics:
| Section | Weight | Objectives |
|---|---|---|
| Topic 1: Troubleshooting & Repair Procedures | 25% | - Diagnostic tools and log analysis - HP 6-step troubleshooting methodology - Component replacement and verification - Network and storage connectivity issues |
| Topic 2: High Availability & Management Solutions | 5% | - Clustering and redundancy concepts - HP System Insight Manager and utilities |
| Topic 3: Installation, Configuration & Upgrades | 25% | - Onboard Administrator (OA) configuration - Firmware updates and system upgrades - iLO and remote management setup - Physical installation and rack integration |
| Topic 4: HP BladeSystem Products & Components | 25% | - c-Class and p-Class enclosures - Storage options and SAN integration - Interconnect modules and mezzanine cards - ProLiant server blades |
| Topic 5: Industry Standard Server & BladeSystem Technologies | 20% | - BladeSystem enclosure infrastructure - Power, cooling, and management architecture - Processor, memory, and system architecture |
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